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Patents

Anti-Microbial Device and Process Therefore:

U.S. Patent No. 11,413,195

Eugene Dan-Jumbo, Bothell, WA.
Assigned to Alpha 1 Engineering Technology Group, Inc., Bothell, WA.

Filed: 5/17/19
Issued: 8/16/22

A material that comprises: at least one outer section; a midsection attached to the at least one outer section, such that the midsection comprises: a first antimicrobial layer configured to contact a body, such that the first antimicrobial layer comprises a center sublayer between two outer sublayers, such the center sublayer comprises: a weave pattern, such that a plurality of first warp tows in the first antimicrobial layer each respectively comprise filaments and each filament of the filaments respectively comprises a first copper that comprises at least one of: first Cu+ ions, first Cu+++ ions, or combinations thereof; and a plurality of first fill tows, such that each fill tow in the plurality of first fill tows respectively comprises a first nanomaterial that consists of a second copper that forms the first fill tows and comprises at least one of: second Cu+ ions, second Cu+++ ions, or combinations thereof; and a second antimicrobial layer disposed adjacent to the first antimicrobial layer; and an air gap disposed between the first and second antimicrobial layers, such that the second antimicrobial layer comprises: a second weave pattern, such that each second warp tow in a plurality of second warp tows respectively comprises second filaments such that each filament in the second filaments respectively comprises a third copper that comprises at least one of third Cu+ ions, third Cu+++ ions, or combinations thereof; and a plurality of second fill tows such that each second fill tow in the plurality of second fill tows respectively comprises a second nanomaterial that comprises a fourth copper that comprises at least one of fourth Cu+ ions or fourth Cu+++ ions; and a gap disposed between the first and the second antimicrobial layers, such that the gap consists of air.

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